Warning: file_put_contents(/www/wwwroot/ppbbbu/n94.cn/cache/20104f093d053c93987bcfa4d28e9589.txt): failed to open stream: No space left on device in /www/wwwroot/ppbbbu/n94.cn/index.php on line 55 bed frame例句_bed frame英汉例句_bed frame双解例句_94生活常识网有道词典
Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production. 全自动粘片机是将半导体晶圆微芯片贴装到引线基架的半导体后工序关键性生产设备。