chip bonding
基本解释
- 片接合
英汉例句
- In thermosonic chip bonding process, the impedance of PZT transducer is a very important parameter.
在热超声芯片键合过程中，PZT换能器阻抗是键合系统的一个重要的研究参数。 - To be an advancing technology in capsulation, there is a well developing foreground for the thermosonic flip-chip bonding.
热超声倒装键合作为前沿封装技术具有良好的发展前景。 - This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。 - This circuitry will allow the microprocessor maker to replace the delicate bonding wires connecting the chip to the package with tiny balls of solder.
FORBES: It's all in the packaging
双语例句
权威例句
词组短语
- Flip -chip-bonding equipment 倒装焊设备
- flip -chip bonding 倒装芯片安装;倒装晶片安装;翻译
- semiconductor chip bonding 半导体芯片焊接
- Thermosonic chip bonding 热超声芯片键合工艺
- chip bonding pad 芯片焊盘
短语
专业释义
- 芯片接合
- 芯片焊接
- 小片焊接
- 芯片焊接