flip chip

基本解释

This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
This text introduces the technology of flip chip, from origins to the development of now, then an evaluation of the advantage in craft and electricity aspectses is made.
文章主要介绍了倒装片技术从起源到现在的发展状况，并对倒装片的工艺优点及电气方面的优点作出评价，提出倒装片将成为今后大型计算机组装工艺中的关键技术。
The methods of 3D interconnection can be classified into the wire bonding, flip chip, through silicon via(TSV) and film wire technology, whose advantages and disadvantages are analyzed.
将实现3D互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。