backside chipping
基本解释
- [電子、通信與自動控制技術]背麪崩裂
英汉例句
- The dicing kerfs have been reduced to below 20 um in many cases, with no chipping on either front or backside.
在很多情況下,刻劃寬度可以小到20um,上下都沒有碎屑。
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雙語例句
专业释义
- 背麪崩裂
And finally it introduces two effective methods to control backside chipping: Stress Relief Step Cutting and Dicing Before Grinding.
同時介紹了兩種控制背麪崩裂較有傚的切割工藝:減少應力的開槽切割工藝和DBG工藝。