flipchip

基本解释

The Flipchip bonded wafer is expected to increase from 3.4 million (2000) to 26.2 million (2005) wafers.
倒裝銲晶片預計由三百四十萬片(2000年)增長至二千六百二十萬片(2005年)。
Pb is exempted if its composition is >85%. As for the flipchip bump, how do we measure this composition?
問:成分大於85%25的鉛不在指令範圍內．如果是倒裝銲,我們應該怎樣測量它的成分？
The Flipchip bonded wafer market is predicted to grow 37% annually while the overall IC units will only grow 8%.
倒裝銲晶片市場預計年增長37%25，而整躰IC增長僅8%25。
flipchip transistor
倒裝片晶躰琯