solder paste
基本解释
- 焊膏；[机] 焊锡膏
英汉例句
- Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。 - The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明：在不考虑其他焊膏印刷性能影响因素下，较高的印刷速度和印刷压力能提高焊膏印刷性能。 - Equipment specifically designed for use with solder paste.
于专为锡膏设计的设备中使用。
双语例句
词组短语
- solder r paste printer 焊膏印刷机
- solder r paste 焊膏
- Solder -paste 焊膏
- solder tin paste 焊锡膏
- lead -free solder tin paste 无铅焊锡膏
短语
专业释义
- 焊膏
A kind of solder paste material was successfully developed.
研制出了新的无铅焊膏材料。 - 膏状钎料
Based on these tests, it proved that copper solder paste had a good wettability, and mechanical properties of brazed joints could reach the request.
证明了紫铜膏状钎料具有良好的润湿性,其钎焊接头机械性能均达要求。电子、通信与自动控制技术
- 焊膏
Mini-stencil is the traditional method used in the electronics manufacturing industry for the deposition of solder paste onto reworked component sites.
最小型模板用于把焊膏淀积到返修的元件部位的电子制造业的传统方法。机械工程
- 焊钖膏
- 焊膏
- 锡膏