solder paste
常见例句
- Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
回流焊:应用加热金属涂敷层的表面和预涂焊膏,熔融,连接和凝固两个金属涂层。 - The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明:在不考虑其他焊膏印刷性能影响因素下,较高的印刷速度和印刷压力能提高焊膏印刷性能。 - Equipment specifically designed for use with solder paste.
于专为锡膏设计的设备中使用。 返回 solder paste