solder paste
常见例句
- Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
廻流銲:應用加熱金屬塗敷層的表麪和預塗銲膏,熔融,連接和凝固兩個金屬塗層。 - The result of simulation indicated that higher printing velocity and printing pressure would improve the performance of solder paste printing if other factors were not considered.
研究表明:在不考慮其他銲膏印刷性能影響因素下,較高的印刷速度和印刷壓力能提高銲膏印刷性能。 - Equipment specifically designed for use with solder paste.
於專爲錫膏設計的設備中使用。 返回 solder paste